Ashwini Vaishnaw Launches Semicon India 2.0 Portal

Union Minister Ashwini Vaishnaw launched the Semicon India 2.0 portal on 6 November 2026. Web application portals opened for Pillars 2, 3 and 4 of the programme, with applications available for specific parts of India’s semiconductor industry.

Applications and ECMS approvals

Under Pillar 2, applications opened for manufacturing semiconductor machinery and materials. Pillar 3 invited applications to establish new semiconductor fabrication plants (fabs), while Pillar 4 targeted the chip assembly, testing and packaging industry. The programme aims to attract at least 200 startups and companies designing chips for India’s requirements.

The government also announced 12 additional projects worth ₹7,503 crore under the Electronics Component Manufacturing Scheme (ECMS). Separately, Vaishnaw approved 12 new applicants under the scheme. The first phase, Semicon India 1.0, began with the launch of its portal in December 2021 and recorded participation from 105 startups.

Important Facts for Exams

• Fabrication process classes: Semiconductor fabrication steps fall into four broad classes: deposition, removal, patterning, and modification of electrical properties.
• Fab cleanroom controls: Fab cleanrooms control dust, vibration, temperature and humidity; vibration damping enables nanometre-scale alignment of photolithography machines.
• Package function and sequence: Integrated-circuit packaging encases a die against physical damage and corrosion, provides contacts to a circuit board, and precedes testing.